Power Adhesives Tecbond 7786 High Temperature Polyamide Hot Melt 12/15 mm

Power Adhesives Tecbond 7786 hot melt adhesive is a high- and low-temperature-resistant polyamide hot melt adhesive designed primarily for low-volume overmoulding and product assembly applications in the electronics industry. It provides excellent bonds to light-gauge metals, printed circuit boards (PCBs) and many plastics, including PVC and ABS.

Tecbond 7786 combines high and low-temperature resistance with very high molten tack. When the substrates are compressed together, the adhesive provides an almost instant grab, helping components remain securely positioned during assembly. Its open time is less than 10 seconds.

The adhesive is available in 12 mm and 15 mm formats and has an application temperature of 180–215°C. Its black colour, polyamide chemistry and rapid initial grab make it suitable for professional manufacturing processes where fast component positioning and resistance to temperature extremes are required.

For maximum shelf life, the manufacturer recommends keeping Tecbond 7786 in its original packaging and storing it away from direct sunlight.

Technical Specifications

• Brand: Power Adhesives
• Product: Tecbond 7786
• Type: high-temperature-resistant hot melt adhesive
• Chemistry: polyamide
• Sizes: 12 mm and 15 mm
• Colour: black
• Open time: less than 10 seconds
• Application temperature: 180–215°C
• Molten tack: very high
• Suitable substrates: light-gauge metal - PCB - PVC - ABS - many plastics
• Primary applications: low-volume overmoulding - product assembly
• Industries: electronics - industrial manufacturing
• Storage: original packaging away from direct sunlight

Key Features

• Polyamide hot melt adhesive with high and low-temperature resistance
• Designed primarily for electronics applications
• Suitable for low-volume overmoulding
• Suitable for industrial product assembly
• Very high molten tack
• Almost instant grab when substrates are compressed
• Open time of less than 10 seconds
• Application temperature of 180–215°C
• Excellent bonding to light-gauge metals and PCBs
• Suitable for PVC, ABS and many other plastics
• Available in 12 mm and 15 mm formats

Applications & Usage

Tecbond 7786 high-temperature hot melt adhesive is designed primarily for low-volume overmoulding and industrial product assembly in the electronics industry. It can be used for bonding light-gauge metals, printed circuit boards (PCBs) and a range of plastic components.

Its very high molten tack provides an almost instant grab when substrates are compressed together. Combined with an open time of less than 10 seconds, this makes Tecbond 7786 suitable for production processes requiring rapid component fixing.

The adhesive is applied at 180–215°C. For maximum shelf life, it should be stored in its original packaging away from direct sunlight.

Advantages

• Designed for applications involving high and low temperatures
• Very high molten tack provides rapid initial grab
• Less than 10-second open time supports fast assembly processes
• Suitable for low-volume electronics overmoulding
• Excellent bonding to PCBs and light-gauge metals
• Suitable for PVC and ABS
• Bonds many plastics used in product assembly
• Available in both 12 mm and 15 mm formats

Applications / Industries

• Electronics industry
• Electrical and electronic component assembly
• Low-volume overmoulding
• PCB applications
• Industrial manufacturing
• Product assembly
• Light-gauge metal bonding
• PVC component bonding
• ABS component bonding
• Plastic component assembly